Buff and Shine and SHINE TP2WG Buffing Kit siphon Confirm e-coat substrate is clean

Confirm e-coat substrate is clean and properly prepared

Stainless steel needle and fluid tip allow for the use of water-based coatings

L113-4 Product Line VAL Manufacturer Valspar Rubberized No About Valspar

Technical specifications for VCS Adapter #12 Part No

Buff and Shine and SHINE TP2WG Buffing Kit siphon Confirm e-coat substrate is cleanKIT HAS A WOOL PAD FOR COMPOUNDS, WHITE WAFFLE FOAM PAD FOR A STEP TWO OR MEDIUM COMPOUNDS AND OR POLISHES, A BLACK WAFFLE FOAM PAD FOR POLISHES AND FINISHING LIQUIDS AND LASTLY IS THE BACKING PLATE THAT ATTACHES TO ALL 3 PADS Specifications Technical specifications for BUFF and SHINE TP2WG Buffing Kit Part No. TP2WG Product Line BUF MFR Model TP2WG Includes (1) 7502G, (1) 899WG, (1) 820WG, (1) 1938HD Buffing Pads, (1) 7 in Backing Plate Manufacturer